(a) (b) (d) 1. part no. expression : (b) inductance code : 47n = 0.047uh (a) series code 2. conf igurat ion & di me ns ions : 4. mate ri als : superworld electronics (s) pte ltd (a) body : ferrite (b) termination : ag/ni/sn a 3. sche mati c : (c) tolerance code : k = 10%, m = 20% 5. ge ne ral sp ecif ication : l3 series ferrite chip inductors pg. 1 note : specifications subject to change without notice. please check our website for latest information. 26.01.2015 1.25 0.20 bd 1.00 ref. 1.00 ref. 3.00 ref. ghl unit:m/m 2.00 0.20 ac 0.85 0.20 0.50 0.30 b ag(100%) ni(100%)-1.5u m(min.) sn(100%)-3.0u m(min.) (c) 1.25 0.20 a) operating temp. : -40 c to +105 c ( including self-temperature. rise ) recommended pc board pattern d c a b h l g b) storage condition (component in its packaging) i) temperature : -10 to 40 c ii) humidity : 60% l 3 - 4 7 n k - (g) 10: standard 11 ~ 99 : internal control number
superworld electronics (s) pte ltd ferrite chip inductors l3 series note : specifications subject to change without notice. please check our website for latest information. pg. 2 26.01.2015 6. electrical characteristics : ( ? ) dc resistance part number l3-47n -10 0.20 l3-68n -10 0.20 50 max. rated current ( ma ) 50 300 test frequency ( mhz ) ( h ) inductance 300 l3-82n -10 0.047 50 0.20 300 0.082 0.068 0.100 l3-r10 -10 0.30 25 250 l3-r18 -10 l3-r15 -10 l3-r12 -10 0.180 0.150 0.120 25 25 25 0.30 0.40 0.40 l3-r33 -10 l3-r27 -1 0 l3-r22 -10 0.330 0.270 0.220 25 25 25 0.50 0.55 0.50 250 l3-r82 -10 l3-1r0 -10 l3-1r2 -10 l3-r68 -10 0.820 1.000 1.200 0.680 l3-r47 -10 l3-r56 -10 l3-r39 -10 0.470 0.560 0.390 10 10 25 25 0.40 0.50 1.00 0.80 150 50 50 25 25 25 0.75 0.65 0.65 l3-1r8 -10 l3-1r5 -10 1.800 1.500 10 10 0.60 0.50 50 50 q min. min. ( mhz ) srf 25 45 25 20 15 15 20 15 100 55 60 75 65 135 115 105 125 150 145 185 170 280 220 200 255 235 320 150 150 200 200 25 25 25 20 20 20 20 20 45 45 45 250 250 250 250 250 l3-4r7 -10 l3-2r2 -10 l3-2r7 -10 l3-3r9 -10 l3-3r3 -10 l3-100 -10 10.000 45 2 2.700 4.700 3.900 3.300 2.200 45 45 45 45 45 10 10 10 10 10 1.15 24 15 0.75 1.00 0.90 0.80 0.65 50 41 35 38 45 30 30 30 30 30 dim. c ( mm ) 0.85 0.85 0.85 1.25 0.85 0.85 0.85 0.85 0.85 0.85 0.85 0.85 1.25 1.25 1.25 0.85 0.85 0.85 0.85 0.85 1.25 1.25 1.25 1.25 1.25 inductance tolerance : : k : 10% l : 15% m : 20% max. 0.2
note : specifications subject to change without notice. please check our website for latest information. superworld electronics (s) pte ltd pg. 3 26.01.2015 ferrite chip inductors l3 series 7. impedance vs. frequency curves : 1 10 100 1 000 dc current(ma) 0.1 1 10 100 indu c tan c e( uh) fci2012 f-series l vs idc. 100 4r7 1r2 r12 1 10 100 frequency(mhz) 0 20 40 60 80 100 120 q fci2012f-series q vs freq. r10 1r0 4r7 100 q vs freq. l vs idc
note : specifications subject to change without notice. please check our website for latest information. superworld electronics (s) pte ltd pg. 6 26.01.2015 ferrite chip inductors l3 series 8. soldering and mounti ng : 8-1. recommended pc board pattern 1.00 3.00 1.00 8-2.2 soldering iron : 8-2.1 lead free solder re-flow : cannot be avoided, the preferred technique is the utilization of hot air soldering tools. mildly activated rosin fluxes are preferred. the terminations are suitable for re-flow soldering systems. if hand soldering recommended temperature profiles for lead free re-flow soldering in figure 1. (refered to j-std-020c) products attachment with a soldering iron is discouraged due to the inherent process control limitations. if a a) preheat circuit and products to 150 c. b) 350 c tip temperature for ferrite chip bead (max) c) never contact the ceramic with the iron tip soldering iron must be employed the following precautions are recommended. for iron soldering in figure 2. note : 8-2. soldering e) use a 20 watt soldering iron with tip diameter of 1.0mm f) limit soldering time to 4-5 secs. d) 1.0mm tip diameter (max) mechanical stress when warping the board. pc board should be designed so that products can prevent damage from preheating tp(260 c/40s max.) 60~180s 4 80s max. figure 1. re-flow soldering:3 times max temperature c 150 25 200 217 time(sec.) within4~5s g rad ual cooling o ve r 60s. figure 2. wave soldering:1 times max cooling 60~150s 20~40s s olde ring natu ral cooling temperature c 150 350 preheating soldering natural re-flow soldering temperatures below 240 degrees, there will be non-wetting risk if wave soldering is used ,there will be some risk. note.
superworld electronics (s) pte ltd note : specifications subject to change without notice. please check our website for latest information. pg. 7 26.01.2015 ferrite chip inductors l3 series may cause the failure of mechanical or electrical performance. solder shall be used not to be exceed as shown in fig. 3. accordingly increasing the solder volume, the mechanical stress to product is also increased. exceeding solder volume figure 3 r ec 0mmendable upper limit t 8-3. solder volume minimum fillet height = soldering thickness + 25% product height
superworld electronics (s) pte ltd note : specifications subject to change without notice. please check our website for latest information. pg. 8 26.01.2015 ferrite chip inductors l3 series 9-1. reel dimension 7" x 12mm r0.5 r10.5 13.5 0.5 7" x 8mm d b 7" x 8mm c 1 2 0 7" x 12mm r1.9 2 0.5 a 178.0 2.0 178.0 2.0 60.0 2.0 b(mm) 60.0 2.0 13.5 0.5 9.0 0.5 a(mm) type 13.5 0.5 13.5 0.5 c(mm) d(mm) 9. packaging information : d1:1 0.1 f:3.5 0.05 p2:2 0.05 p e:1.75 0.1 po:4 0.1 size 3(12) w:8.0 0.1 bo section a-a ko ao a 5 4(11) t a d:1.5+0.1 1.27 0.10 1.45 0.10 1.55 0.10 3.42 0. 10 2.77 0. 10 3.50 0.10 2.35 0.10 1.88 0.10 1.50 0.10 4.0 0.10 0.22 0.05 4.0 0.10 4.0 0.10 0.22 0.05 0.22 0.05 ko(mm) bo(mm) ao(mm) p(mm) t(mm) material of taping is plastic 1.0 0.10 1.0 0.10 1.0 0.10 d1(mm) p(mm) 4.0 0.10 4.0 0.10 1.50 0.05 1.05 0.05 1.85 0.05 2 3(09) 2.30 0.05 size bo(mm) 0.95 0.05 0.95 0.05 ko(mm) ao(mm) 0.95 0.05 0.95 0.05 t(mm) p po:4 0.1 p2:2 0.1 f:3.5 0.1 e:1.75 0.1 ao d:1.56 +0.1 -0.05 bo w:8.0 0.1 ko t 2.0 0.05 p(mm) 0.38 0.05 0 size bo(mm) 0.68 0.05 ko(mm) 0.50max ao(mm) t(mm) 0.50max material of taping is paper p po:4 0.1 f:3.5 0.05 e:1.75 0.1 ao d:1.5+0.1/-0.0 bo w:8.0 0.3 ko t 9-2.1 tape dimension / 8mm 4(09) 1.04 0.10 3.40 0.10 1.77 0.10 4.0 0.10 0.22 0.05 1.0 0.10 2.0 0.10 0.62 0.03 1 1.12 0. 03 0.60 0. 03 0.60 0. 03 2(08) 1.05 0.10 1.95 0.10 1.05 0.10 4.0 0.10 0.23 0.05 none 3(09) 1.04 0.10 2.25 0.10 1.42 0.10 4.0 0.10 0.22 0.05 1.0 0.10
note : specifications subject to change without notice. please check our website for latest information. superworld electronics (s) pte ltd pg. 9 26.01.2015 ferrite chip inductors l3 series 9-2.2 tape dimension / 12mm p f:5.5 0.05 d1:1.5 0.1 a e:1.75 0.1 po:4 0.1 d:1.5+0.1 a size w:12.0 0.1 bo section a-a ko ao p2:2 0.05 t 6 1.93 0.1 ko(mm) ao(mm) bo(mm) 4.95 0.1 1.93 0.1 p(mm) t(mm) 4.0 0.1 0.24 0.05 base tape 9-4. tearing off force top cover tape 165 c to 180 c f chip size chip / reel inner box middle box carton 9-3. packaging quantity 125000 62500 40000 20000 75000 150000 2500 12500 4000 1000 75 15000 3000 4(11) the force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. teari ng speed room humidity room temp. ( c) 5~35 (%) 45~85 room atm 860~1060 (hpa) 300 (mm/min) 200000 100000 100000 200000 50000 100000 20000 2 4000 20000 10000 2000 4000 3(09) 3(12) d1(mm) 1.5 0.1 7 1.85 0.1 4.95 0.1 3.66 0.1 8.0 0.1 0.24 0.05 1.5 0.1 500000 250000 50000 1 10000 750000 375000 75000 0 15000 80000 40000 2000 8000 6 75000 150000 3000 15000 4(09) series z / l a) recommended products should be used within 12 months from the time of delivery. b) the packaging material should be kept where no chlorine or sulfur exists in the air. b) the use of tweezers or vacuum pick up is strongly recommended for individual components. c) bulk handling should ensure that abrasion and mechanical shock are minimized. a) products should be handled with care to avoid damage or contamination from perspiration and skin oils. to maintain the solderabililty of terminal electrodes : 1. storage conditions : application notice 2. transportation :
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